Structural Member Quality Assessment at Samsung Taylor
Jun 8, 2025
C&Y Engineering Conducts Structural Member Quality Assessment at Samsung Taylor Semiconductor Facility
C&Y Engineering is proud to have completed a comprehensive Structural Member Quality Assessment for the Samsung Taylor FAB Semiconductor Building—an advanced industrial facility currently under development in Taylor, Texas. This large-scale structure, composed primarily of precast concrete members including girders, beams, columns, slabs, and connection assemblies, is designed to support high-performance semiconductor manufacturing operations.
The assessment, conducted in collaboration with Samsung C&T Corporation as part of an ongoing quality assurance and risk mitigation process, ensures that all structural elements are code-compliant, safe, and consistent with the original engineering design intent. C&Y Engineering performed detailed inspections and evaluations guided by industry standards and building codes, including:
ACI 318-19 – Building Code Requirements for Structural Concrete
ACI 224R-01 – Control of Cracking in Concrete Structures
IBC 2018 – International Building Code
ASCE 7-16 – Minimum Design Loads and Associated Criteria
PCI Design Handbook – Precast and Prestressed Concrete Guidelines
Manufacturer-specific quality documents and shop drawings
Inspection Details:
Preliminary Site Review: May 27–29, 2025
Main Inspection Dates: June 3–6, 2025
Lead Structural Engineer: Youngsang Cho, P.E.
Field Inspection Performed By: C&Y Engineering, LLC
Engineering Oversight and Evaluation By: C&Y Engineering, LLC
Report Issued By: C&Y Engineering
This inspection serves as the official engineering record for the structural evaluation of the precast system. Through rigorous analysis and close coordination with site teams, C&Y Engineering reaffirmed its commitment to structural safety, technical excellence, and reliable engineering oversight.
We are honored to support a project of this scale and significance and remain dedicated to ensuring the quality and integrity of the structures shaping tomorrow’s technology.